2019 iPhone Models to Sport Upgraded Selfie Sensor, Three 12-Megapixel Rear Sensors: Ming-Chi Kuo

2019 iPhone Models to Sport Upgraded Selfie Sensor, Three 12-Megapixel Rear Sensors: Ming-Chi Kuo
quickbit/sources:neilpatel.com

 

TFI Securities expert Ming-Chi Kuo has now discharged another speculator note enumerating the cutting edge iPhone models' camera capacities. As per Kuo, the 2019 iPhones will have an overhauled 12-megapixel selfie sensor, and the excellent models will highlight a triple back camera setup also. The triple back camera setup on the iPhone XS and iPhone XS Max successors will have three 12-megapixel sensors. To review, the present gen iPhone XS and iPhone XS Max have double camera setups at the back, and the front sensors are at 7-megapixel.

MacRumors got hold of Kuo's speculator note, and it recommends that all selfie sensors will be at 12-megapixel. The iPhone XR ₹ 74,900 successor will don a double back camera setup, however, the megapixel subtleties haven't been shared. The current iPhone XR sports a solitary 12-megapixel back sensor.

The two iPhone XS ₹ 99,900 and iPhone XS Max ₹ 109,900 successors will brandish a triple back camera setup with one 12-megapixel zooming focal point and two 12-megapixel wide-edge focal points. The two telephones are tipped to don 5.8-inch and 6.5-inch OLED shows individually. Kuo says in his note

We forecast the camera upgrade will be one of the new 2H19 iPhone's major selling points. Critical spec upgrades are as follows. (1) Rear cameras of 6.5-inch OLED, 5.8-inch OLED, and 6.1-inch LCD will likely upgrade to triple-camera and dual-camera, respectively. A super-wide camera will be newly adopted by the triple-camera system, which is equipped with the 12MP/1um CIS provided exclusively by Sony. (2) The front camera of all three new iPhone models will likely upgrade to 12MP CIS+5P lens (vs. current 7MP CIS+4P lens).

The 2019 iPhones are also reported to sport reverse wireless charging. They are all expected to be powered by the new Apple A13 SoC using TSMC's new 7nm EUV process. These chips are expected to enter mass production in mid-2019.